IJBTT

Estimation of Non-Reciprocal Behavior and Junction Temperature of an IC LED Driver by Thermal Impedance Matrix Measurement

	International Journal of Engineering Trends and Technology (IJETT)
	© 2017 by IJETT Journal
	Volume-45 Number-6
	Year of Publication : 2017
	Authors : Norazlina M. S., Dheepan Chakravarthii M. K., Shanmugan S., Mutharasu D., Shahrom Mahmud
	DOI :  10.14445/22315381/IJETT-V45P255

Citation 

Norazlina M. S., Dheepan Chakravarthii M. K., Shanmugan S., Mutharasu D., Shahrom Mahmud "Estimation of Non-Reciprocal Behavior and Junction Temperature of an IC LED Driver by Thermal Impedance Matrix Measurement", International Journal of Engineering Trends and Technology (IJETT), V45(6),262-266 March 2017. ISSN:2231-5381. www.ijettjournal.org. published by seventh sense research group

Abstract
The thermal path behaviour of the electronic device is often characterized by considering the single heat source and single junction to ambient thermal resistance. In case of IC drivers, the heat source within the device is multiple due to many integrated components such as transistor, internal resistor, and etc on the single die. Hence the evaluation of IC drivers with multiple heat sources is absolutely necessary for imparting suitable thermal management design within the devices. This study aims at evaluating the factor affecting the thermal performance of the IC driver. In this study, thermal transient measurement method and linear superposition technique have been used to measure the junction temperature of the Device under Test (DUT). Also, the thermal impedance of the DUT has been characterized using structure function extracted from the cooling curve. The obtained result of the thermal impedance showed the non-reciprocal behaviour of the thermal transfer impedance (off-diagonal). In terms of structure function, the total Rth-JA of region A is higher than region B and C. From the linear superposition technique, the junction temperature was calculated which showed that the region A (148.07 °C) showed the higher value compared to region B (132.72 °C) and C (139.46 °C). Therefore, it can be concluded that a single die has multiple heat source which increase exponentially in multiple directions resulting in invariable driver performance and failure. Thus, the presence of multiple heat source in the driver was identified as potential performance affecting factor as it caused non-uniform thermal heat distribution within the driver. The outcome of this study benefits in selection of suitable thermal management technique in IC packages.

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Keywords
Thermal transient measurement, non-reciprocal, multiple heat source, LED IC driver.