Research of The New Soldering Alloys Based On Sn-Sr and Sn-Ag-Sr

  IJETT-book-cover  International Journal of Engineering Trends and Technology (IJETT)          
  
© 2021 by IJETT Journal
Volume-69 Issue-10
Year of Publication : 2021
Authors : Roman Kolenak, Alexej Pluhar, Igor Kostolny, Jaromir Drapala
  10.14445/22315381/IJETT-V69I10P207

MLA 

MLA Style: Roman Kolenak, Alexej Pluhar, Igor Kostolny, Jaromir Drapala  "Research of The New Soldering Alloys Based On Sn-Sr and Sn-Ag-Sr" International Journal of Engineering Trends and Technology 69.10(2021):46-51. 

APA Style: Roman Kolenak, Alexej Pluhar, Igor Kostolny, Jaromir Drapala. Research of The New Soldering Alloys Based On Sn-Sr and Sn-Ag-Sr  International Journal of Engineering Trends and Technology, 69(10), 46-51.

Abstract
The aim of the research was to characterize the soldering alloys type Sn1Sr and Sn3.5Ag1Sr. The DTA analysis of Sn1Sr solder has identified the eutectic reaction at the temperature of 232 °C. In the case of Sn3.5Ag1Sr solder, the eutectic reaction takes place at the temperature of 222 °C, which corresponds to the thermodynamic data for the given alloy type Sn-Ag-Sr. The microstructural SEM analysis has identified in soldering alloy type Sn1Sr the needles of primary precipitated intermetallic phase in the matrix formed of peritectic together with Sn, having majority proportion in the matrix. In the Sn1Sr solder, there was additionally observed the (Sn) + SrSn4 eutectics with a high tin content. When analyzing the microstructure of Sn3.5Ag1Sr solder, the acicular constituents formed of ε- Ag3Sn and Sr-Ag-Sn phases were observed. Also, the (Sn) + ε-Ag3Sn eutectics was identified in solder volume. The solder matrix is formed of pure tin.

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Keywords
active solder, microstructure, soldering, intermetallic phase, EDX analysis